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OEM Full Turnkey Black Thick Copper PCB Board Electronics For Power Module

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OEM Full Turnkey Black Thick Copper PCB Board Electronics For Power Module

MOQ : 1

Price : Send us Gerber file for free quotation

Payment Terms : T/T

Layer : 16 Layer

Base Material : PI

Thickness : 1.0mm

Copper : 6OZ

Min. Line Width/Space : 0.1/0.1mm

Color : Black

Application : Power Module

Certificate : UL,IATF16949,ISO&Reach

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High Frequency Reliable Thick Copper PCB Black Board for Power Module

♦ What is Thick copper PCB?

   

Thick copper PCB refers to a circuit board formed by bonding a layer of copper foil with a thickness of 2 ounces (oz, about 62.5 microns) or more to FR-4 or other substrates during the printed circuit board (PCB) manufacturing process.

OEM Full Turnkey Black Thick Copper PCB Board Electronics For Power Module OEM Full Turnkey Black Thick Copper PCB Board Electronics For Power Module OEM Full Turnkey Black Thick Copper PCB Board Electronics For Power Module

Features of Thick Copper PCB

    • High current carrying capacity: Thick copper reduces resistance, carries 100A current, and improves power density.
    • Strong heat dissipation: Fast heat conduction, temperature rise can be controlled within 40°C.
    • High mechanical strength: Vibration and shock resistance, adaptable to harsh working conditions.
    • High frequency stability: Low signal attenuation, supports high-speed transmission.
    • High reliability: Wide temperature operation (-40°C~150°C), long-term stability.

Applications of Thick Copper PCB

    • ​​Power supply equipment: high-power switching power supply, inverter, UPS, etc.
    • ​​Automotive electronics: electric vehicle motor controller, on-board charger, battery management system.
    • ​​Industrial control: motor driver, servo controller, welding equipment.
    • ​​New energy field: photovoltaic inverter, wind power converter.
    • High-power LED lighting: LED driver board that needs heat dissipation and current carrying.

Special structure in thick copper PCB design

    • Copper-based sandwich design:A copper-based heat dissipation layer (such as copper bricks or copper foil stacking) is embedded in the traditional FR-4 substrate to form a "sandwich" structure, which increases the local heat dissipation capacity by 3 times and is used for direct installation of IGBT modules.

    • Step-type copper thickness design:Different copper thicknesses are used in different areas on the same PCB (such as 8oz in the power area and 1oz in the signal area) to balance the current carrying and signal integrity requirements. Copper layer partitioning needs to be achieved by laser cutting or milling.

Technical Parameters

Item

Specification

Laers

1~32

Board thickness

0.1mm-7.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger + BGA

Material Suppilers

Shengyi, KB, Nanya, ITEQ,etc.

One-Stop PCBs Solution

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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry;
    • Perfect after-sales service system;
    • From prototype to mass production


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