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Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device

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Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device

MOQ : 1

Price : Inquiry Us

Payment Terms : T/T

Layer : 4 Layer

Board Thickness : 0.8m

Board Material : Polyimide (PI)

Finished Copper : 0.5 OZ

Min Line Width/Spacing : 0.1/0.1mm

Surface Finish : ENIG

Application : Portable Devices

Certificate : UL,IATF16949,ISO&Reach

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4 Layer PCB Flexible Board for Medical Device

♦ What is 4 Layer PCB?

A 4-layer PCB is a printed circuit board with four conductive copper layers stacked together with insulating (dielectric) material in between. These layers are interconnected through vias (plated holes) to create complex circuits while saving space and improving performance compared to single or double-sided boards.

Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device

♦ Structure of a 4-Layer PCB

A typical 4-layer stackup consists of:

1. Top Layer (Signal Layer) – Contains component placements and high-speed signal traces.
2. Inner Layer 1 (Ground Plane) – Acts as a reference plane for EMI shielding and noise reduction.
3. Inner Layer 2 (Power Plane) – Distributes stable power supply to components.
4. Bottom Layer (Signal Layer) – Additional routing space for signals and components.

♦ 4-Layer PCB vs. 2-Layer PCB

Feature	4-Layer PCB	2-Layer PCB
Layers	4 (Signal+GND+PWR)	2 (Top+Bottom)
Routing Space	✅ High	❌ Limited
Signal Noise	✅ Low (GND plane)	❌ Higher
EMI Shielding	✅ Better	❌ Poor
Cost	⚠️ Higher (~2x)	✅ Lower

♦ Manufacturing Process

1. Design – Use CAD tools (Altium, KiCad) to define layer stackup and routing.
2. Material Selection – Choose core/prepreg materials (FR-4, Rogers).
3. Lamination – Bond layers under heat/pressure.
4. Drilling & Plating – Create vias for inter-layer connections.
5. Etching – Remove excess copper to form traces.
6. Testing – Verify continuity, impedance, and shorts.

♦ Technical Parameters

Item	Spec
Layers	1~64
Board Thickness	0.1mm-10 mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance	士0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm

Product Tags:

Polyimide rigid flex pcb fabrication

ENIG rigid flex pcb fabrication

Polyimide 4 layer circuit board

Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device Images

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